ESREF concentrates on two main areas of interest in electronics concerning designers, manufacturers and users:
- Strategy for Quality and Reliability Assessment during Product Development and Life Cycle
- Advanced Analysis Techniques for Technologies and Product Evaluation
The Technical Programme Committee will select original papers that address one or more of the following topics :
Quality and Reliability Techniques for
Devices and Systems
Reliability simulation, Virtual qualification |
Packaging and Assembly Reliability
Board level reliability, |
Physical Modeling and Simulation for Reliability Prediction
|
Failure Mechanisms in New Materials and Transistors
|
Power Devices Reliability
| |
Reliability of New Technologies
|
Advanced Failure Analysis: Defect Detection and Analysis
|
Invited speakers
Paul Nicollian (Texas Instruments); Insights on Trap Generation and Breakdown in Ultra Thin SiO2 and SiON Dielectrics from Low Voltage Stress Induced Leakage Current Measurements
Jeroen van den Brand (TNO Holst Center); Systems-in-foil - Devices, Fabrication processes and reliability issues
Cristian Russ (Infineon); ESD in advanced CMOS bulk and FinFet technologies: Processing technology, protection devices and circuit
strategies
Peter Moens(AMI-Semiconductors); Reliability assessment of integrated power transistors: lateral DMOS versus Vertical DMOS
Fred Kuper (NXP); Automotive IC reliability: elements of the battle towards zero defects
Philippe Perdu (CNES); Failure Analysis of advanced CMOS technology: some trends, state of the art and future challenges
Andreas Altes (infineon); Advanced thermal failure analysis and reliability investigations– industrial demands and their limitations
Fen CHEN (IBM); Cu/Low-k dielectric TDDB reliability issues for advanced CMOS technologies
This list is updated on a regular basis.
For further information concerning the scientific programme, please contact:
Ton Mouthaan