TECHNICAL SCOPE

ESREF concentrates on two main areas of interest in electronics concerning designers, manufacturers and users:

- Strategy for Quality and Reliability Assessment during Product Development and Life Cycle
- Advanced Analysis Techniques for Technologies and Product Evaluation

The Technical Programme Committee will select original papers that address one or more of the following topics :

Quality and Reliability Techniques for Devices and Systems
 Reliability simulation, Virtual qualification
 Reliability indicators, Early detection, Screening methods
 Reliability test structures, Limits to accelerated tests
 Yield/reliability relationship, Field reliability
 Realisation of stringent reliability requirements, Zero defects
Packaging and Assembly Reliability
 Board level reliability,
 Failure mechanisms and environmental constraints,
 MCM, CSP, BGA, SiP, WLP, QFN, advanced PCB,
 Bonding, solders and joints,
 Connectors.
Physical Modeling and Simulation for Reliability Prediction
 Characterization of defects,
 Defect models,
 Numerical simulation,
 Simulation of reliability-related circuit constraints.
Failure Mechanisms in New Materials and Transistors
 Process-related issues,
 Hot carriers, NBTI, PBTI
 Passivation stability,
 Dielectric integrity, High-K gate oxides,
 Metal migration: mechanical and thermal aspects,
 Latchup, ESD,
 Low-K dielectrics and Cu interconnects.
 Reliability related to nanotechnology.
Power Devices Reliability
 Smart-power devices, IGBT, thyristors,
 Thermal management.
Reliability of New Technologies
 Non-volatile and programmable devices,
 Silicon on Insulator devices,
 Wide bandgap semiconductors,
 Microwave and compound semiconductor devices,
 Photonic devices: Optoelectronics and lasers,
 MEMS and MOEMS, Sensors and actuators,
 Interconnects,
 Passive elements and modules.
Advanced Failure Analysis: Defect Detection and Analysis
 Electron, ion and laser beam techniques,
 Static or dynamic techniques,
 Backside techniques,
 Scanning probe techniques,
 Acoustic microscopy,
 Electrical and thermal characterization,
 ,Sample preparation, construction analysis
 Failure analysis: case studies.

Tutorials by experts will provide review presentations of relevant topics.
Invited papers will introduce the mainstream topics.
Keynote Speakers
Marc de Jong(NXP Semiconductors) ; Bridging the Business Model Gap between the Semiconductor Industry and the Automotive Industry with respect to Quality and Reliability
Asraf M Alam (Perdue University); Reliability- and process-variation aware design of integrated circuits

Invited speakers
Paul Nicollian (Texas Instruments); Insights on Trap Generation and Breakdown in Ultra Thin SiO2 and SiON Dielectrics from Low Voltage Stress Induced Leakage Current Measurements
Jeroen van den Brand (TNO Holst Center); Systems-in-foil - Devices, Fabrication processes and reliability issues
Cristian Russ (Infineon); ESD in advanced CMOS bulk and FinFet technologies: Processing technology, protection devices and circuit strategies
Peter Moens(AMI-Semiconductors); Reliability assessment of integrated power transistors: lateral DMOS versus Vertical DMOS
Fred Kuper (NXP); Automotive IC reliability: elements of the battle towards zero defects
Philippe Perdu (CNES); Failure Analysis of advanced CMOS technology: some trends, state of the art and future challenges
Andreas Altes (infineon); Advanced thermal failure analysis and reliability investigations– industrial demands and their limitations
Fen CHEN (IBM); Cu/Low-k dielectric TDDB reliability issues for advanced CMOS technologies

This list is updated on a regular basis.


For further information concerning the scientific programme, please contact:

Ton Mouthaan

esref2008@ewi.utwente.nl