Programme 
2 page overview with the ESREF sessions (Tentative)

Program booklet (version September 2008)( PDF file)

Tutorials, Monday 29 september afternoon

T1) Building-in reliability in power electronic systems (joint ESREF -ECPE tutorial) by Eckhard Wolfgang and Wolfgang Gerling
T2) Surface ESD (ESDFOS) in Assembly Fab Machineries as a Functional and Reliability Risk - Failure Analysis, Tool Diagnosis and On-Site-Remedies by Peter Jacob
T3) RF MEMS design for reliability by Xavier Rottenberg
T4) Low-K reliability by Zsolt Tokei

See program booklet for abstracts

Workshops

Monday 29 September 2008 EFUG (European FIB Users Group) Workshop will be organized by Arne de Groot (NXP Semiconductors - The Netherlands). For further information, please visit: www.imec.be/efug/EFUG20la.html
Thursday 2 October 2008
The EUFANET 2008 meeting (European Failure Analysis NETwork) will be organized by Philippe Perdu (CNES - France). This edition will focus on a technical hot topic linked to up to date challenges in Failure Analysis. More info on EUFANET at www.eufanet.org.
The workshop is free of charge. If you want to join this workshop you van email Philippe Perdu.

Annual Power Devices workshop will be chaired by Eckard WOLFGANG (Siemens - Germany) and Mauro CIAPPA (ETH Zurich - Switzerland)
Topic: Advances in wide- temperature power electronics Experts will report and discuss results from European projects as well as from conferences.
Expert board: Martin Rittner (Bosch, Germany) Wofgang Wondrak (Daimler, Germany) Peter Borthen (TU Munich, germany)



Keynote Speakers
Marc de Jong/Drue Freeman (NXP Semiconductors); Bridging the Business Model Gap between the Semiconductor Industry and the Automotive Industry with respect to Quality and Reliability
Asraf M Alam (Perdue University); Reliability- and process-variation aware design of integrated circuits

Invited Speakers
Paul Nicollian (Texas Instruments); Insights on Trap Generation and Breakdown in Ultra Thin SiO2 and SiON Dielectrics from Low Voltage Stress Induced Leakage Current Measurements
Jeroen van den Brand (TNO Holst Center); Systems-in-foil - Devices, Fabrication processes and reliability issues
Cristian Russ (Infineon); Electrostatic discharge in advanced CMOS bulk and FinFet technologies: Processing technology, protection devices and circuit strategies
Peter Moens(AMI-Semiconductors); Reliability assessment of integrated power transistors: lateral DMOS versus Vertical DMOS
Fred Kuper (NXP); Automotive IC reliability: elements of the battle towards zero defects
Philippe Perdu (CNES); Failure Analysis of advanced CMOS technology: some trends, state of the art and future challenges
Andreas Altes; Advanced thermal failure analysis and reliability investigations – industrial demands and their limitations
Fen CHEN (IBM); Cu/Low-k dielectric TDDB reliability issues for advanced CMOS technologies